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- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
TE Connectivity AMP Connectors |
290
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CFP RIDING
|
- | Board Level | Aluminum | 3.181" (80.80mm) | 4.390" (111.50mm) | Push Pin | 0.404" (10.27mm) | - | - | - | Black Anodized | ||||
Apex Microtechnology |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT
|
Apex Precision Power | Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | Top Mount | Copper | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD Pad | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM NATURAL SMD
|
218 | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin |