- Material：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
3,658
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | SOT-32, TO-220 | 0.630" (16.00mm) | - | - | 9.00°C/W | ||
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CUI Inc. |
988
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | Rectangular | TO-220 | 0.354" (9.00mm) | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | Rectangular, Fins | TO-220 | 0.354" (9.00mm) | 3.7W @ 75°C | 6.84°C/W @ 200 LFM | 20.27°C/W | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | Rectangular, Fins | TO-220 | 0.354" (9.00mm) | 3.1W @ 75°C | 7.07°C/W @ 200 LFM | 24.19°C/W |
