- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 3
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
CUI Inc. |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Rectangular | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Rectangular, Fins | 3.7W @ 75°C | 6.84°C/W @ 200 LFM | 20.27°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
Rectangular, Fins | 3.1W @ 75°C | 7.07°C/W @ 200 LFM | 24.19°C/W |
