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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
4,921
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3 dias |
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.6W ALUMINUM
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Board Level, Vertical | 0.900" (22.86mm) | Clip | 0.740" (18.79mm) | 2.6W @ 75°C | 6.32°C/W @ 200 LFM | 28.85°C/W | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.4W ALUMINUM
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Top Mount | 0.985" (25.00mm) | Clip and Board Mounts | 0.961" (24.40mm) | 4.4W @ 75°C | 4.51°C/W @ 200 LFM | 17.05°C/W |
