- Material:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 7,261
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
1,207
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X6MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | - | 15.83°C/W @ 100 LFM | - | Blue Anodized | ||||
ASSMANN WSW Components |
6,178
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 1.181" (30.00mm) | Bolt On and PC Pin | TO-220 | 0.472" (12.00mm) | - | - | 7.00°C/W | Black Anodized | ||||
ASSMANN WSW Components |
179
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 1.811" (46.00mm) | Bolt On | TO-220 | 1.299" (33.00mm) | - | - | 4.60°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
163
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X25MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 7.44°C/W @ 100 LFM | - | Blue Anodized | ||||
Ohmite |
215
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIPS FOR 2 TO-220
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | - | Black Anodized | ||||
Wakefield-Vette |
680
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X50MM TO-247 TO-264
|
OmniKlip | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | Clip, Solder Foot | TO-247, TO-264 | 1.500" (38.10mm) | - | - | - | Black Anodized | ||||
Ohmite |
368
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 2 CLIPS
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | - | Degreased | ||||
Ohmite |
296
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 2 CLIPS
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
114
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 50X50X14MM
|
- | Top Mount | Copper | Square, Fins | 1.969" (50.00mm) | Push Pin | BGA | 0.551" (14.00mm) | - | 2.10°C/W @ 200 LFM | 8.90°C/W | AavSHIELD 3C | ||||
ASSMANN WSW Components |
2,177
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | - | 8.50°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
258
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 9.48°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
118
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X15MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 5.87°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
102
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.472" (12.00mm) | - | 8.17°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
295
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X10MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 18.78°C/W @ 100 LFM | - | Blue Anodized | ||||
Ohmite |
175
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR 2 TO-220
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | - | Degreased | ||||
Advanced Thermal Solutions Inc. |
170
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12.7MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 15.86°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
187
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X15MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | - | 13.70°C/W @ 100 LFM | - | Blue Anodized | ||||
CUI Inc. |
1,061
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.181" (30.00mm) | PC Pin | TO-220 | 0.472" (12.00mm) | 7.7W @ 75°C | 4.05°C/W @ 200 LFM | 9.74°C/W | Black Anodized | ||||
Ohmite |
101
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 50MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.969" (50.00mm) | 3 Clips and PC Pin | TO-101 | - | - | - | 5.30°C/W | Black Anodized | ||||
Wakefield-Vette |
924
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X50MM 2-CLIP TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | Clip, Solder Foot | TO-220 | 1.500" (38.10mm) | - | - | - | Black Anodized |