- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Ohmite |
16
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM EXTRUSION 5"
|
HS | Board Level, Vertical | Aluminum Alloy | 3.924" (99.67mm) | Bolt On | Aluminum Housed Resistor | 1.210" (30.73mm) | - | - | 1.30°C/W | Unfinished | ||||
Wakefield-Vette |
75
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK C2026 REV A
|
465 | Board Level | Aluminum | 4.000" (101.60mm) | Press Fit | Stud Mounted Diode | 4.000" (101.60mm) | 50.0W @ 38°C | 0.30°C/W @ 500 LFM | 0.76°C/W | Black Anodized | ||||
Ohmite |
15
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM EXTRUSION 5"
|
HS | Board Level, Vertical | Aluminum Alloy | 3.924" (99.67mm) | Bolt On | Aluminum Housed Resistor | 1.210" (30.73mm) | - | - | 1.30°C/W | Unfinished |