Fabricante:
Series:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Descubre los productos 3
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
AH50600V05000FE
Ohmite
16
3 dias
-
MOQ: 1  MPQ: 1
ALUMINUM EXTRUSION 5"
HS Board Level, Vertical Aluminum Alloy 3.924" (99.67mm) Bolt On Aluminum Housed Resistor 1.210" (30.73mm) - - 1.30°C/W Unfinished
465K
Wakefield-Vette
75
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK C2026 REV A
465 Board Level Aluminum 4.000" (101.60mm) Press Fit Stud Mounted Diode 4.000" (101.60mm) 50.0W @ 38°C 0.30°C/W @ 500 LFM 0.76°C/W Black Anodized
AH50600V05000EE
Ohmite
15
3 dias
-
MOQ: 1  MPQ: 1
ALUMINUM EXTRUSION 5"
HS Board Level, Vertical Aluminum Alloy 3.924" (99.67mm) Bolt On Aluminum Housed Resistor 1.210" (30.73mm) - - 1.30°C/W Unfinished