- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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1.378" (35.00mm) | 0.492" (12.50mm) | 9.6W @ 75°C | 3.76°C/W @ 200 LFM | 7.81°C/W | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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1.359" (34.50mm) | 0.492" (12.50mm) | 9.1W @ 75°C | 9.10°C/W @ 200 LFM | 8.24°C/W | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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1.378" (35.00mm) | 1.000" (25.40mm) | 14.4W @ 75°C | 2.31°C/W @ 200 LFM | 5.21°C/W |
