Descubre los productos 4
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
HF35G
Aavid, Thermal Division of Boyd Corporation
1,757
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB/CLIP-ON
- Board Level, Vertical Rectangular, Fins 1.380" (35.05mm) 1.102" (28.00mm) Clip and PC Pin TO-220 0.787" (19.99mm) 2.0W @ 20°C 6.00°C/W @ 300 LFM
908-35-1-12-2-B-0
Wakefield-Vette
2,281
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 35X35X12MM ELLIPTICAL
908 Top Mount Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) Clip BGA 0.457" (11.60mm) - 3.10°C/W @ 200 LFM
908-35-2-12-2-B-0
Wakefield-Vette
191
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 35X35X12MM PIN
908 Top Mount Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) Clip BGA 0.457" (11.60mm) - 3.10°C/W @ 200 LFM
LA363B5CB
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK PWR 1.25"H BLACK TO-3
LA363B5 Board Level Rhombus 1.630" (41.40mm) 1.290" (32.77mm) Bolt On TO-3 1.250" (31.75mm) - -