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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,706
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STAGGERED FIN
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- | Board Level, Vertical | Rectangular, Fins | 0.875" (22.22mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 2.0W @ 40°C | 6.00°C/W @ 400 LFM | 16.70°C/W | ||
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CTS Thermal Management Products |
192
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | ||
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CTS Thermal Management Products |
661
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 5.20°C/W @ 400 LFM | 16.50°C/W |
