- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 12.0W @ 70°C | 6.20°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 6.0W @ 40°C | 6.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 6.0W @ 40°C | 5.80°C/W | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X38.1MM
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Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.638" (41.60mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 0.984" (25.00mm) | 8.0W @ 40°C | - | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 25X41.6X38.1MM
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Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.000" (25.40mm) | 10.0W @ 50°C | - |
