Fabricante:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Descubre los productos 19
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
ATS-51250R-C1-R0
Advanced Thermal Solutions Inc.
809
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 25MM X 25MM X 19.5MM
maxiGRIP, maxiFLOW Top Mount Aluminum Square, Angled Fins 0.984" (25.00mm) 0.984" (25.00mm) - Clip, Thermal Material BGA 0.768" (19.50mm) - - Black Anodized
647-10ABEP
Wakefield-Vette
2,795
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS BLK 1"
647 Board Level, Vertical Aluminum Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - Bolt On and PC Pin TO-220 1.000" (25.40mm) 6.0W @ 42°C - Black Anodized
ATS-54350R-C1-R0
Advanced Thermal Solutions Inc.
522
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 35MM X 35MM X 19.5MM
- Top Mount Aluminum Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - Thermal Tape, Adhesive (Included) BGA 0.768" (19.50mm) - - Black Anodized
ATS-53350R-C1-R0
Advanced Thermal Solutions Inc.
1,714
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 35MM X 35MM X 19.5MM
maxiGRIP Top Mount Aluminum Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - Clip, Thermal Material BGA 0.768" (19.50mm) - - Black Anodized
ATS-X53350P-C1-R0
Advanced Thermal Solutions Inc.
280
3 dias
-
MOQ: 1  MPQ: 1
SUPERGRIP HEATSINK 35X35X17.5MM
superGRIP Top Mount Aluminum Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - Clip, Thermal Material BGA 0.689" (17.50mm) - - Blue Anodized
4-1542005-0
TE Connectivity AMP Connectors
357
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 25MM 7FIN RADIAL
- - Aluminum Cylindrical - - 1.375" (34.92mm) OD Clip BGA 0.894" (22.71mm) - 10.50°C/W Black Anodized
CE-OMNI-38
Wakefield-Vette
543
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CER TO-220 TO-247
- Board Level, Vertical Ceramic Rectangular, Fins 0.803" (20.40mm) 1.339" (34.00mm) - Solderable Feet TO-220, TO-247 1.512" (38.40mm) - 7.00°C/W -
780652F00000G
Aavid, Thermal Division of Boyd Corporation
6
3 dias
-
MOQ: 1  MPQ: 1
78065 EXTRUSION 1.1X0.76"X4.1
- Top Mount Aluminum Rectangular, Pin Fins 49.500" (1257.3mm) 0.764" (19.40mm) - - - 0.847" (21.50mm) - - -
ATS-59003-C1-R0
Advanced Thermal Solutions Inc.
61
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 32MM X 50MM X 12MM
maxiGRIP Top Mount Aluminum Rectangular, Angled Fins 1.260" (32.00mm) 1.969" (50.00mm) - Clip Flip Chip Processors 0.472" (12.00mm) - - Black Anodized
ATS-PCB1041
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220
- Board Level Aluminum Rectangular, Fins 1.644" (41.76mm) 1.290" (32.77mm) - Bolt On TO-220 1.000" (25.40mm) - 11.00°C/W Black Anodized
APR33-33-12CB/A01
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/THERMAL TAPE
APR Top Mount Aluminum Square, Pin Fins 1.283" (32.60mm) 1.283" (32.60mm) - Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.457" (11.60mm) - - Black Anodized
ATS-54350R-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 35X35X19.5MM W/OUT TIM
- Top Mount Aluminum Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - Thermal Tape, Adhesive (Not Included) BGA 0.768" (19.50mm) - - Black Anodized
ATS-54290W-C1-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEAT SINK 29MM X 29MM X 24.5MM
- Top Mount Aluminum Square, Fins 1.142" (29.01mm) 1.142" (29.01mm) - Thermal Tape, Adhesive (Included) BGA 0.964" (24.50mm) - - Black Anodized
ATS-54290W-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 29X29X24.5MM W/OUT TIM
- Top Mount Aluminum Square, Fins 1.142" (29.01mm) 1.142" (29.01mm) - Thermal Tape, Adhesive (Not Included) BGA 0.964" (24.50mm) - - Black Anodized
647-10ABP
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS BLK 1"
647 Board Level, Vertical Aluminum Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - Bolt On and PC Pin TO-220 1.000" (25.40mm) 6.0W @ 42°C - Black Anodized
APR33-33-12CB
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FORGED 33 X 33 X 12MM
APR Top Mount Aluminum Square, Pin Fins 1.283" (32.60mm) 1.283" (32.60mm) - Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.457" (11.60mm) - - Black Anodized
APR33-33-12CB/S
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FORGED WITH SMALL CLIP
APR Top Mount Aluminum Square, Pin Fins 1.283" (32.60mm) 1.283" (32.60mm) - Clip Assorted (BGA, LGA, CPU, ASIC...) 0.457" (11.60mm) - - Black Anodized
APR33-33-12CB/M
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FORGED WITH MEDIUM CLIP
APR Top Mount Aluminum Square, Pin Fins 1.283" (32.60mm) 1.283" (32.60mm) - Clip Assorted (BGA, LGA, CPU, ASIC...) 0.457" (11.60mm) - - Black Anodized
APR33-33-12CB/T
CTS Thermal Management Products
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FORGED WITH TALL CLIP
APR Top Mount Aluminum Square, Pin Fins 1.283" (32.60mm) 1.283" (32.60mm) - Clip Assorted (BGA, LGA, CPU, ASIC...) 0.457" (11.60mm) - - Black Anodized