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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 1,562
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,710
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK 1" TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 4.00°C/W @ 200 LFM | 5.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
7,326
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL MNT W/TABS
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.480" (37.59mm) | - | Bolt On and PC Pin | TO-220 (Dual) | 0.500" (12.70mm) | 2.0W @ 30°C | 3.00°C/W @ 700 LFM | 13.20°C/W | ||
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Wakefield-Vette |
38,100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BGA/PGA 16.5X16.5X8.9
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Penguin | Board Level | Aluminum | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
6,071
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS 1.5"TALL
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.500" (38.10mm) | 10.0W @ 50°C | 3.00°C/W @ 200 LFM | 3.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
1,969
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218/TO-220 PIN
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220, TO-218 | 1.000" (25.40mm) | 4.0W @ 30°C | 1.50°C/W @ 600 LFM | 5.60°C/W | ||
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Ohmite |
2,569
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 1.0"
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F | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | - | Bolt On and PC Pin | TO-220 | 0.984" (25.00mm) | 4.0W @ 30°C | 3.00°C/W @ 400 LFM | 4.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
3,240
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 POWER W/PINS BK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 20.0W @ 60°C | 2.00°C/W @ 300 LFM | 2.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
6,975
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 2"
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
2,906
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN/CLIP
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
3,440
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB-KOOLCLIP
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | - | Clip and PC Pin | TO-220 | 0.480" (12.19mm) | 6.0W @ 60°C | 5.00°C/W @ 200 LFM | 10.40°C/W | ||
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Wakefield-Vette |
17,584
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Top Mount | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
5,813
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
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624 | Top Mount | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | ||
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Ohmite |
2,414
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 218 247 1.0"
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R | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.654" (42.00mm) | 0.985" (25.00mm) | - | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.000" (25.40mm) | 2.0W @ 20°C | 1.50°C/W @ 200 LFM | 4.80°C/W | ||
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Wakefield-Vette |
2,632
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Top Mount | Aluminum | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
2,876
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1.25W H=.25" BLK
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- | Top Mount | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 25.00°C/W @ 200 LFM | 54.00°C/W | ||
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Ohmite |
9,471
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263 BLACK
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
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Ohmite |
4,608
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AND CLIP FOR TO-220 BLK
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W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.201" (30.50mm) | 0.720" (18.29mm) | - | Clip and PC Pin | TO-220 | 0.630" (16.00mm) | 1.0W @ 20°C | - | 12.00°C/W | ||
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Wakefield-Vette |
4,845
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
5,350
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Adhesive | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
5,941
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - |
