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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
661
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.21"SQ
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BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 16.50°C/W | ||
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Wakefield-Vette |
1,546
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR STUD MT DIODE BLACK
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695 | Board Level | - | - | - | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Bolt On | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 18.00°C/W |
