- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
5,421
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DC/DC HALF BRICK VERT
|
Bolt On | 0.450" (11.43mm) | 7.0W @ 60°C | 3.20°C/W @ 300 LFM | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BXB50,75,100,150.24"VRT
|
Bolt On, Thermal Material | 0.240" (6.10mm) | 5.0W @ 60°C | 5.80°C/W @ 300 LFM | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BXB50,75,100,150.45"VRT
|
Bolt On, Thermal Material | 0.450" (11.43mm) | 7.0W @ 60°C | 3.20°C/W @ 300 LFM |