- Series：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Descubre los productos 8
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Apex Microtechnology |
688
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO3
|
Apex Precision Power | Board Level | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | - | Bolt On | TO-3 | 0.750" (19.05mm) | 7.0W @ 80°C | 11.70°C/W | ||
|
|
|
ASSMANN WSW Components |
2,812
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 15X12.8MM
|
- | Board Level | Rectangular, Fins | 0.591" (15.01mm) | 0.504" (12.80mm) | - | Press Fit | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | - | ||
|
|
|
ASSMANN WSW Components |
9,919
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.80MM
|
- | Board Level | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | Press Fit | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,914
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | - | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | 25.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
1,239
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9.5MM
|
- | Top Mount | Square, Pin Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X9.5MM W/OUT TIM
|
- | Top Mount | Square, Pin Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | - | - | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.8W @ 50°C | 21.00°C/W | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X22.8X17.8MM
|
- | Board Level, Vertical | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | - | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | - |
