- Length：
-
- Width：
-
- Diameter：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 43
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
6,712
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Rectangular, Fins | 0.334" (8.50mm) | 0.250" (6.35mm) | - | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,876
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1.25W H=.25" BLK
|
- | Top Mount | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 25.00°C/W @ 200 LFM | 54.00°C/W | ||
|
|
|
Wakefield-Vette |
321
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 HORZ MT NO HOLES
|
641 | Board Level | Rectangular, Angled Fins | 3.000" (76.20mm) | 4.125" (104.77mm) | - | TO-3 | 1.000" (25.40mm) | 15.0W @ 36°C | 0.90°C/W @ 250 LFM | 2.40°C/W | ||
|
|
|
Wakefield-Vette |
338
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUSION IGBT/SSR BLK
|
392 | Top Mount | Rectangular, Fins | 7.087" (180.01mm) | 4.921" (124.99mm) | - | Power Modules | 5.346" (135.79mm) | - | 0.10°C/W @ 100 LFM | 0.43°C/W | ||
|
|
|
ASSMANN WSW Components |
56,109
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Cylindrical | - | - | 0.122" (3.10mm) ID, 0.235" (6.00mm) OD | - | 0.087" (2.20mm) | - | - | - | ||
|
|
|
ASSMANN WSW Components |
2,812
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 15X12.8MM
|
- | Board Level | Rectangular, Fins | 0.591" (15.01mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | ||
|
|
|
ASSMANN WSW Components |
9,919
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.80MM
|
- | Board Level | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 14.00°C/W @ 200 LFM | - | ||
|
|
|
ASSMANN WSW Components |
1,389
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLK ANOD ALUM TO-220
|
- | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 0.504" (12.80mm) | - | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | ||
|
|
|
ASSMANN WSW Components |
1,169
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Rectangular, Fins | 0.748" (19.00mm) | 0.250" (6.35mm) | - | 14-DIP and 16-DIP | 0.189" (4.80mm) | - | - | 46.00°C/W | ||
|
|
|
ASSMANN WSW Components |
2,946
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Rectangular, Fins | 0.900" (23.00mm) | 0.250" (6.35mm) | - | 18-DIP | 0.189" (4.80mm) | - | - | 40.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,556
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-92 .72" BLK
|
- | Board Level, Vertical | Rectangular, Fins | 0.602" (15.29mm) | - | - | TO-92 | 0.720" (18.29mm) | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | 60.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,490
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .75" BLACK
|
- | Top Mount | Rectangular, Fins | 0.750" (19.05mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | TO-5 | 0.395" (10.03mm) | 1.0W @ 30°C | 20.00°C/W @ 300 LFM | 35.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,068
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1W H=.375" BLK
|
- | Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | TO-5 | 0.375" (9.52mm) | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,468
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1W H=.25"BLK
|
- | Board Level | Cylindrical | - | - | 0.305" (7.75mm) ID, 0.500" (12.70mm) OD | TO-5 | 0.250" (6.35mm) | 0.6W @ 40°C | 35.00°C/W @ 200 LFM | 63.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,925
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-18 1W BLK
|
- | Top Mount | Cylindrical | - | - | 0.180" (4.57mm) ID, 0.500" (12.70mm) OD | TO-18 | 0.235" (5.97mm) | 0.6W @ 60°C | 30.00°C/W @ 500 LFM | 100.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,436
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .4" BLK
|
- | Top Mount | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | TO-5 | 0.400" (10.16mm) | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,003
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 2W BLK
|
- | Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD | TO-5 | 0.250" (6.35mm) | 1.4W @ 70°C | 35.00°C/W @ 200 LFM | 56.00°C/W | ||
|
|
|
Wakefield-Vette |
173
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
401 | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 4.750" (120.65mm) | - | TO-3, Stud Mount | 1.250" (31.75mm) | 30.0W @ 80°C | 1.50°C/W @ 250 LFM | 3.00°C/W | ||
|
|
|
Wakefield-Vette |
255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
421 | Board Level | Rectangular, Fins | 3.000" (76.20mm) | 4.750" (120.65mm) | - | TO-3, DO-5, Stud Mount | 2.625" (66.67mm) | 50.0W @ 58°C | 0.70°C/W @ 250 LFM | 1.16°C/W | ||
|
|
|
Wakefield-Vette |
204
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER NO MNT HOLES BLK
|
423 | Board Level | Rectangular, Fins | 5.421" (139.70mm) | 4.750" (120.65mm) | - | TO-3, DO-5, Stud Mount | 2.625" (66.67mm) | 50.0W @ 47°C | 0.50°C/W @ 250 LFM | 0.96°C/W |
