Descubre los productos 7
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
ATS-51310K-C1-R0
Advanced Thermal Solutions Inc.
1,482
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 31MM X 31MM X 14.5MM
maxiGRIP, maxiFLOW Top Mount Square, Angled Fins 1.220" (30.99mm) 1.220" (30.99mm) Clip, Thermal Material BGA 0.571" (14.50mm) - -
ATS-55350R-C1-R0
Advanced Thermal Solutions Inc.
26
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 35MM X 35MM X 19.5MM
- Top Mount Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) Thermal Tape, Adhesive (Included) BGA 0.768" (19.50mm) - -
HSS-B20-NPS-02
CUI Inc.
956
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 5.1W ALUMINUM
- Board Level, Vertical Rectangular, Fins 0.500" (12.70mm) 1.000" (25.40mm) Bolt On and Board Mounts TO-220 1.180" (29.97mm) 5.1W @ 75°C 14.71°C/W
HSS-B20-NPR-02
CUI Inc.
968
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 5.1W ALUMINUM
- Board Level, Vertical Rectangular, Fins 0.500" (12.70mm) 1.000" (25.40mm) Bolt On and Board Mounts TO-220 1.180" (29.97mm) 5.1W @ 75°C 14.71°C/W
ATS-55290W-C1-R0
Advanced Thermal Solutions Inc.
97
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 29MM X 29MM X 24.5MM
- Top Mount Square, Pin Fins 1.142" (29.01mm) 1.142" (29.01mm) Thermal Tape, Adhesive (Included) BGA 0.964" (24.50mm) - -
ATS-55350R-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 35X35X19.5MM W/OUT TIM
- Top Mount Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) Thermal Tape, Adhesive (Not Included) BGA 0.768" (19.50mm) - -
ATS-55290W-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 29X29X24.5MM W/OUT TIM
- Top Mount Square, Pin Fins 1.142" (29.01mm) 1.142" (29.01mm) Thermal Tape, Adhesive (Not Included) BGA 0.964" (24.50mm) - -