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- Condiciones seleccionadas:
Descubre los productos 354
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
69
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3 dias |
-
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MOQ: 1 MPQ: 1
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1/4 BRICK HEATSINK 58X37X6.1MM
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maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 2.283" (58.00mm) | 1.457" (37.00mm) | - | Quarter Brick DC/DC Converter | 0.240" (6.10mm) | - | 12.10°C/W @ 200 LFM | - | Gold Anodized | |||
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Delta Electronics |
12
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL NEHALEM 1366
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- | Board Level | Aluminum | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | LGA | 1.004" (25.50mm) | - | - | 0.26°C/W | - | ||
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Delta Electronics |
28
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA2011
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- | Board Level | Aluminum | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | - | LGA | 1.004" (25.50mm) | - | - | 0.24°C/W | - | ||
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Apex Microtechnology |
12
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR DK AND HQ PACKAGES
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | - | - | 0.400" (10.16mm) | - | - | 16.00°C/W | - | ||
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Apex Microtechnology |
9
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 .95C/W
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 3.000" (76.20mm) | 4.750" (120.65mm) | - | TO-3 | 3.000" (76.20mm) | 50.0W @ 60°C | 0.35°C/W @ 300 LFM | 0.95°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
586
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-126 BLACK
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- | Board Level | Aluminum | Rectangular, Fins | 0.520" (13.21mm) | 0.775" (19.68mm) | - | TO-126 | 0.319" (8.10mm) | - | 25.00°C/W @ 200 LFM | 35.80°C/W | Black Anodized | |||
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ASSMANN WSW Components |
305
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BLK ANOD ALUM TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.866" (22.00mm) | - | TO-220 | 0.748" (19.00mm) | - | - | 22.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
214
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.378" (35.00mm) | 0.669" (17.00mm) | - | TO-220 | 0.512" (13.00mm) | - | - | 17.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
465
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK
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- | Board Level | Aluminum | Rectangular, Fins | 1.673" (42.49mm) | 1.000" (25.40mm) | - | TO-220 | 0.992" (25.20mm) | - | 4.40°C/W @ 200 LFM | 10.00°C/W | Black Anodized | |||
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ASSMANN WSW Components |
450
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.476" (37.50mm) | 1.142" (29.00mm) | - | KLP | 0.472" (12.00mm) | - | - | 13.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
523
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.476" (37.50mm) | 1.142" (29.00mm) | - | KLM | 0.472" (12.00mm) | - | - | 13.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
971
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 2.283" (58.00mm) | 2.047" (52.00mm) | - | TO-220 | 0.059" (1.50mm) | - | 12.20°C/W @ 200 LFM | 21.00°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
843
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 BLACK
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- | Board Level | Aluminum | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | - | TO-3 | 1.220" (31.00mm) | - | 2.60°C/W @ 200 LFM | 6.00°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
56
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3 dias |
-
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MOQ: 1 MPQ: 1
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1/2 BRICK HEATSINK 58X61X6.1MM
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maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 2.283" (58.00mm) | 2.401" (61.00mm) | - | Half Brick DC/DC Converter | 0.240" (6.10mm) | - | 9.40°C/W @ 200 LFM | - | Gold Anodized | |||
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Delta Electronics |
31
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA2011
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- | Board Level | Aluminum | Square, Fins | 3.602" (91.50mm) | 3.602" (91.50mm) | - | LGA | 2.519" (64.00mm) | - | - | 0.17°C/W | - | ||
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CUI Inc. |
988
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | Rectangular | 0.984" (25.00mm) | 0.625" (16.00mm) | - | TO-220 | 0.354" (9.00mm) | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | Black Anodized | ||
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CUI Inc. |
981
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.2W ALUMINUM
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- | Board Level | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | 0.500" (12.70mm) | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | Black Anodized | ||
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CUI Inc. |
974
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.2W ALUMINUM
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- | Board Level | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | 0.500" (12.70mm) | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | Black Anodized | ||
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Trenz Electronic GmbH |
48
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TE0715 SPRINGLOADED
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TE0715 | Top Mount | - | Rectangular, Fins | - | - | - | TE0715 | - | - | - | - | - | ||
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Trenz Electronic GmbH |
26
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TE0710 SPRINGLOADED
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TE0710 | Top Mount | - | Rectangular, Fins | - | - | - | TE0710 | - | - | - | - | - |
