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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.620" (41.15mm) | 2.000" (50.80mm) | TO-220 | 0.750" (19.05mm) | 9.0W @ 60°C | 5.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | TO-3 | 0.750" (19.05mm) | 2.0W @ 30°C | 13.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | 1.250" (31.75mm) | 7.0W @ 50°C | 8.00°C/W |
