- Series：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Apex Microtechnology |
2
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 6P DIP
|
Apex Precision Power | Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | 6-DIP | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.620" (41.15mm) | 2.000" (50.80mm) | TO-220 | 0.750" (19.05mm) | 9.0W @ 60°C | 4.00°C/W @ 200 LFM |
