- Type：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
1,546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR STUD MT DIODE BLACK
|
695 | Board Level | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 5.20°C/W @ 400 LFM | 18.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK
|
- | - | - | - | - | - | - | - |
