Fabricante:
Series:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Descubre los productos 6
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Length Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
V4330N
ASSMANN WSW Components
3,125
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ANOD ALUM TO-220
- Top Mount Aluminum 0.787" (20.00mm) TO-220 - - 12.00°C/W
V4330K
ASSMANN WSW Components
382
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ANOD ALUM
- Board Level Aluminum 1.476" (37.50mm) KLP - - 11.00°C/W
V6560K
ASSMANN WSW Components
450
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level Aluminum 1.476" (37.50mm) KLP - - 13.00°C/W
V6560R
ASSMANN WSW Components
523
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level Aluminum 1.476" (37.50mm) KLM - - 13.00°C/W
V6560N
ASSMANN WSW Components
76
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level Aluminum 0.787" (20.00mm) TO-220 - - 15.00°C/W
HSE-B20350-NP
CUI Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220, 35
HSE Board Level Aluminum Alloy 1.378" (35.00mm) TO-220 6.2W @ 75°C 2.91°C/W @ 200 LFM 12.10°C/W