- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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ASSMANN WSW Components |
539
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 36.83X17.80MM
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1.450" (36.83mm) | 0.700" (17.78mm) | TO-220 | 0.850" (21.60mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
283
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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2.000" (50.80mm) | 1.750" (44.45mm) | TO-3 | 0.375" (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | ||
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ASSMANN WSW Components |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK BLK ALUM TO-220 DUAL
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1.450" (36.83mm) | 1.750" (44.45mm) | TO-220 (Dual) | 0.370" (9.40mm) | - | - |
