- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Condiciones seleccionadas:
Descubre los productos 496
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | ||
NXP USA Inc. |
Consulta
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-
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MOQ: 84 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
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Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b,16x10b | External | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b,16x10b | External | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b,16x10b | External | CANbus,EBI/EMI,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 84 MPQ: 1
|
912XDT512J1 GENERAL
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | 3.15 V ~ 5.5 V | A/D 8x12b | External | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 750 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tape & Reel (TR) | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Cut Tape (CT) | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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- | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 600 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 360 MPQ: 1
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IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
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- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 600 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | 119 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 84 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI |