- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Data Converters：
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- Oscillator Type：
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- Condiciones seleccionadas:
Descubre los productos 112
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
963
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
2,280
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
534
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
1,260
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
679
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
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NXP USA Inc. |
840
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
287
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
466
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
510
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
284
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
692
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
370
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
103
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
519
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
111
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI |
