- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Data Converters:
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- Condiciones seleccionadas:
Descubre los productos 11
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Data Converters | Connectivity | ||
NXP USA Inc. |
1,200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | 91 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | 59 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | 59 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | 91 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | 91 | A/D 16x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | 59 | A/D 8x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | 119 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | 119 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | 119 | A/D 24x10b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | 59 | A/D 8x10b,16x10b | CANbus,I2C,SCI,SPI | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | 59 | A/D 8x10b,16x10b | CANbus,I2C,SCI,SPI |