- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Speed：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Condiciones seleccionadas:
Descubre los productos 496
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
1,958
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 80QFP
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Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 50MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
888
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
1,852
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 1MB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
1,800
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 144LQFP
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Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
432
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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|
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NXP USA Inc. |
963
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
2,280
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
534
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,382
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
1,200
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
1,260
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
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Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
925
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 64K x 8 | 1MB (1M x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
300
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
575
|
3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
679
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
838
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3 dias |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 256KB FLASH 144LQFP
|
Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | 119 | 50MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
1,002
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 50MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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NXP USA Inc. |
361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | ||
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|
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NXP USA Inc. |
840
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | 91 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
413
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
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Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI |
