- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 9
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,535
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 13MM
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0.780" (19.81mm) | 0.520" (13.21mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 1.5W @ 50°C | 8.00°C/W @ 500 LFM | 28.30°C/W | ||
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CUI Inc. |
1,950
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
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0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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CUI Inc. |
2,094
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
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0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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CUI Inc. |
2,094
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 21MM
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0.780" (19.81mm) | 0.520" (13.21mm) | Clip and Board Locks | TO-220 | 0.515" (13.08mm) | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 20.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.700" (17.78mm) | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.040" (26.42mm) | 0.866" (22.00mm) | Clip | TO-220 | 0.375" (9.52mm) | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19.4X25.4X11.4MM
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0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.9X15X9.5MM
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0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - |
