833900T00000

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.375" (9.52mm)

Length :

0.590" (14.99mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D2Pak)

Power Dissipation @ Temperature Rise :

2.0W @ 40°C

Series :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

5.00°C/W @ 400 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level

Width :

1.020" (25.91mm)