- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 60
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 14.5MM
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Square, Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 5.00°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
32
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 40MM X 40MM X 14.5MM
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Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 4.60°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
27
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 42.5 X 42.5 X 14.5MM
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Square, Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 4.30°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
93
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 32.5 X 32.5 X 19.5MM
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Square, Fins | 1.280" (32.51mm) | 1.280" (32.51mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 4.10°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 14.5MM
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Square, Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 4.10°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
45
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 19.5MM
|
Square, Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 3.50°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
32
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 19.5MM
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Square, Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 2.80°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
81
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 46MM X 16MM
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Rectangular, Angled Fins | 1.378" (35.00mm) | 1.811" (46.00mm) | Clip | Flip Chip Processors | 0.630" (16.00mm) | 2.40°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
61
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
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Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | Clip | Flip Chip Processors | 0.472" (12.00mm) | 3.80°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 32MM X 50MM X 12MM
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Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | Clip | Flip Chip Processors | 0.472" (12.00mm) | 3.20°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
74
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 62MM X 52MM X 13MM
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Rectangular, Fins | 2.441" (62.00mm) | 2.047" (52.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | 3.20°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
65
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 62MM X 52MM X 13MM
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Rectangular, Fins | 2.441" (62.00mm) | 2.047" (52.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | 3.20°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
52
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 37MM X 10MM
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Rectangular, Angled Fins | 1.142" (29.01mm) | 1.457" (37.00mm) | Clip | Flip Chip Processors | 0.394" (10.00mm) | 6.20°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
77
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 45MM X 9MM
|
Rectangular, Angled Fins | 0.827" (21.00mm) | 1.772" (45.00mm) | Clip | Flip Chip Processors | 0.354" (9.00mm) | 6.10°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
87
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 32MM X 13MM
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Rectangular, Angled Fins | 0.984" (25.00mm) | 1.260" (32.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | 6.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 28MM X 45MM X 11MM
|
Rectangular, Angled Fins | 1.772" (45.00mm) | 1.102" (28.00mm) | Clip | Flip Chip Processors | 0.433" (11.00mm) | 4.50°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
14
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 14.5MM
|
Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 5.40°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
18
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 9.5MM
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Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 20.20°C/W @ 200 LFM | |||
|
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Advanced Thermal Solutions Inc. |
18
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 27MM X 27MM X 14.5MM
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Square, Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 7.60°C/W @ 200 LFM | |||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 42.5X42.5X24.5MM
|
Square, Fins | 1.673" (42.49mm) | 1.673" (42.49mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - |
