- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Advanced Thermal Solutions Inc. |
577
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 29MM X 29MM X 19.5MM
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Square, Fins | 1.142" (29.01mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 5.00°C/W @ 200 LFM | |||
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Advanced Thermal Solutions Inc. |
69
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 29MM X 9.5MM
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Square, Fins | 1.142" (29.01mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 13.10°C/W @ 200 LFM | |||
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Advanced Thermal Solutions Inc. |
34
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 29MM X 14.5MM
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Square, Fins | 1.142" (29.01mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 7.10°C/W @ 200 LFM | |||
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Advanced Thermal Solutions Inc. |
52
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 37MM X 10MM
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Rectangular, Angled Fins | 1.457" (37.00mm) | Clip | Flip Chip Processors | 0.394" (10.00mm) | 6.20°C/W @ 200 LFM |
