- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
48
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
Square, Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 8.40°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 14.5MM
|
Square, Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 4.10°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
32
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 19.5MM
|
Square, Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 2.80°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
77
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 45MM X 9MM
|
Rectangular, Angled Fins | 0.827" (21.00mm) | Clip | Flip Chip Processors | 0.354" (9.00mm) | 6.10°C/W @ 200 LFM |
