- Material：
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- Length：
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- Width：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 12
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
11,699
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
15,536
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
3,782
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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Board Level, Vertical | Copper | 1.100" (27.94mm) | 0.866" (22.00mm) | Clip and PC Pin | TO-220 | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 19.20°C/W | ||
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Advanced Thermal Solutions Inc. |
919
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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Board Level, Vertical | Steel | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and Board Mounts | TO-220 | - | 14.00°C/W @ 200 LFM | 35.70°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.6W @ 30°C | 5.00°C/W @ 700 LFM | 35.70°C/W | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | - | TO-263 (D2Pak) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | 1.040" (26.42mm) | 0.866" (22.00mm) | Clip | TO-220 | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.5X22X28MM
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Board Level, Vertical | Copper | 1.100" (27.94mm) | 0.866" (22.00mm) | Clip and PC Pin | TO-220 | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | - | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.9X15X9.5MM
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Board Level | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - |
