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Descubre los productos 43
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK 128PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | Thermal Tape, Adhesive (Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | Press Fit | TO-5 | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin |
