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Descubre los productos 3,471
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Wurth Electronics Inc. |
546
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3 dias |
-
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MOQ: 1 MPQ: 1
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CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
728
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3 dias |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
728
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3 dias |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Laird Technologies EMI |
464
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3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET FAB/FOAM 5X457.2MM DSHAPE
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.197" (5.00mm) | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
67
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3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET FAB/FOAM 4.95X457.2MM SQ
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- | - | Fabric Over Foam | - | Square | 0.197" (5.00mm) | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
42
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3 dias |
-
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MOQ: 1 MPQ: 1
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GASKT FABRIC/FOAM 8X457.2MM RECT
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.157" (4.00mm) | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
26
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3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET FAB/FOAM 19.1X457.2MM REC
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- | - | Fabric Over Foam | - | Rectangle | 0.059" (1.50mm) | 18.000" (457.20mm) | 0.752" (19.10mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
97
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Harwin Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
56
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3 dias |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
56
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3 dias |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
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Wurth Electronics Inc. |
22
|
3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET FABRIC/FOAM 6MMX1M DSHAPE
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WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.079" (2.00mm) | 39.370" (1.00m) | 0.236" (6.00mm) | - | - | Non-Conductive Adhesive | ||
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Laird Technologies EMI |
22
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGRSTOCK BECU ALY 7.57X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Harwin Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD CLIP MINI TIN SMD
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- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
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Harwin Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder |
