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- Operating Temperature:
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- Type:
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- Material:
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- Shape:
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- Height:
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- Length:
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- Width:
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- Plating:
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- Plating - Thickness:
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- Condiciones seleccionadas:
Descubre los productos 3,471
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
22
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB LS-SERIES 1/8X24X24
|
ECCOSORB | - | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
14
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB LS-SERIES 1/4X24X24
|
ECCOSORB | - | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
25
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MF LOAD SERIES 1/4X12
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ECCOSORB | - | Absorbing Sheet | - | Round | - | 12.000" (304.80mm) | 0.250" (6.35mm) | - | - | - | ||||
ITT Cannon,LLC |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||||
Laird Technologies EMI |
770
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||||
Laird Technologies EMI |
770
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||||
Harwin Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
400
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
400
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||||
Laird Technologies EMI |
350
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||||
Laird Technologies EMI |
350
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||||
Wurth Electronics Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
958
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
958
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder |