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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
9-19UD-AU-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.09 X 0.19 AU 16--9-19UD-AU-16-
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.090" (2.29mm) 16.000" (406.40mm) 0.190" (4.83mm) Gold Flash Adhesive
4-53D-AU-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.05 X 0.53 AU 16--4-53D-AU-16--
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.050" (1.28mm) 16.000" (406.40mm) 0.530" (13.46mm) Gold Flash Adhesive
6000-0050-72
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.500" X 50 LONG TECHMESH TAPE--
- Gasket Sleeve - - - - 0.500" (12.70mm) Tin - -
4B99AB50B09600
Laird Technologies EMI
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MOQ: 1  MPQ: 1
GK NICU NRS PU NR REC
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11-S-32AH-AU-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.11 X 0.32 AU 16--11-S-32AH-AU-
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.320" (8.13mm) Gold Flash Adhesive
14-37FS-BD-300""
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.14 X 0.36 BD 300"--FOLDED SERI
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 25.00 (7.62m) 0.370" (9.40mm) Unplated - Adhesive
3-23TV30-SN-300""
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.08 SN 300--TWIST RIGHT
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 25.00 (7.62m) 0.080" (2.03mm) Tin Flash Adhesive
6-34T-BD-300
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.07 X 0.34 BD 300--6-34T-BD-300
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 25.00 (7.62m) 0.340" (8.64mm) Unplated - Adhesive
27229375
Laird Technologies EMI
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MOQ: 1  MPQ: 1
LOK ROD 1/2X12
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6000-0225-72
Leader Tech Inc.
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MOQ: 1  MPQ: 1
2.25" X 50 LONG TECHMESH TAPE--
- Gasket Sleeve - - - - 2.250" (57.15mm) Tin - -
8300015044
Laird Technologies EMI
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MOQ: 1  MPQ: 1
ELMT,MT,CUTIPLAT,RL
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23-60FS-BD-400
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 400--FOLDED SERIE
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 33.33 (10.16m) 0.600" (15.24mm) Unplated - Adhesive
228031300
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
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228031000
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
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25-109FSDS-SN-300""
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 SN 300"--FOLDED SERI
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Tin Flash Adhesive
228031400
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
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25-109FSDS-BD-300
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 BD 300"--FOLDED SERI
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated - Adhesive
25-78FS-BD-300
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.25 X 0.78 BD 300"--FOLDED SERI
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 0.780" (19.81mm) Unplated - Adhesive
8-25FSC-BD-400
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.08 X 0.25 BD 400--FOLDED SERIE
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.080" (2.03mm) 33.33 (10.16m) 0.250" (6.35mm) Unplated - Adhesive
228032000
Laird Technologies EMI
Consulta
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MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
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