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- Material：
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- Shape：
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- Plating：
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- Condiciones seleccionadas:
Descubre los productos 37
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
328
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 7.11X406.4MM
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- | - | - | - | - | 16.000" (406.40mm) | - | - | - | ||
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Laird Technologies EMI |
102
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3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Leader Tech Inc. |
76
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3 dias |
-
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MOQ: 1 MPQ: 1
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FSG，.252"H X .280"W X 48"L
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- | Fabric Over Foam | - | C-Fold | 0.252" (6.40mm) | 48.000" (121.90cm) | - | - | - | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,NID,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,ZNC,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,ZNY,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,NIE,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SU,PSA
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121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Leader Tech Inc. |
10
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3 dias |
-
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MOQ: 1 MPQ: 1
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EMI FABRIC GASKET 1.52X7.11MM
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-40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Ripstop (NI/CU) | Rectangular | 0.060" (1.52mm) | 23.62" (599.95mm) | - | - | Non-Conductive Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 BD 16--11-28RH-BD-16
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-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 BD 16--11-S-28RH-BD-
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-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.060"H X .280"W X 48"L--RECTANGU
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-40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 4.00 (1.22m) | - | - | - |
