- Series:
-
- Operating Temperature:
-
- Shape:
-
- Length:
-
- Width:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Condiciones seleccionadas:
Descubre los productos 53
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
139
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FSG,.25"H X .375"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | - | ||||
Laird Technologies EMI |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.81X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
78
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | ||||
Leader Tech Inc. |
53
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 12.000" (304.80mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNPB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead,Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .375"W X 0.40"L--D SHAP
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | D-Shape | 0.400" (10.16mm) | 0.375" (9.53mm) | - | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .600"W X 10"L--RECTANGU
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Rectangular | 10.000" (254.00mm) | 0.600" (15.24mm) | - | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .500"W X 8"L--RECTANGUL
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Rectangular | 8.000" (203.20mm) | 0.500" (12.70mm) | - | - | - |