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- Operating Temperature：
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- Condiciones seleccionadas:
Descubre los productos 35
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Attachment Method | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Attachment Method | |
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Leader Tech Inc. |
139
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3 dias |
-
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MOQ: 1 MPQ: 1
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FSG，.25"H X .375"W X 48"L
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- | - | Fabric Over Foam | - | D-Shape | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | ||
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Laird Technologies EMI |
405
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 24MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.375" (9.53mm) | 0.940" (23.88mm) | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
97
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Consulta
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-
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MOQ: 1 MPQ: 1
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GASKET BECU 19.81X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 1.090" (27.69mm) | - | Hardware，Rivet，Solder | ||
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Leader Tech Inc. |
78
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3 dias |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | Adhesive | |||
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Leader Tech Inc. |
53
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3 dias |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | - | Adhesive | |||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL BF USF
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"H X .375"W X 0.40"L--D SHAP
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.400" (10.16mm) | 0.375" (9.53mm) | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"H X .600"W X 10"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 10.000" (254.00mm) | 0.600" (15.24mm) | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"H X .500"W X 8"L--RECTANGUL
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 8.000" (203.20mm) | 0.500" (12.70mm) | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 BD 47.625 NTP--FOLDE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"H X .375"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"W X .250"H X 6.75"L--SQUARE
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | - | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | |||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.250"X.500"X.125" COMBO W/ ADH--
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- | -75°C ~ 260°C | Gasket | - | Rectangular | - | 0.500" (12.70mm) | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 BD 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | Adhesive | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 BD 85.875 NTP--FOLDE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | Adhesive |
