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- Operating Temperature:
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Descubre los productos 1,795
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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UFR,BECU,BF,RL
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- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.75 SN 16 NTP--12-75RS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.750" (19.05mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
OBSTK,ELECNIT ELAST CORE
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- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
PUP,ASSY,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
CP,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 BELL
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 PSH
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.73--11-32RH-SN-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IO NICU PTAF PU V0 REC
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,PSA,CTL
|
- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IO NICU MESHG PU V0 REC
|
- | - | - | - | - | - | - | - | - | - |