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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Operating Temperature Type Material Height Length Width Plating Plating - Thickness Attachment Method
8101010140
Laird Technologies EMI
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MOQ: 1  MPQ: 1
UFR,BECU,BF,RL
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12-75RS-SN-16-NTP
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.12 X 0.75 SN 16 NTP--12-75RS-S
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.120" (3.05mm) 16.000" (406.40mm) 0.750" (19.05mm) Tin Flash Adhesive
8409016854
Laird Technologies EMI
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MOQ: 1  MPQ: 1
OBSTK,ELECNIT ELAST CORE
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3-23UT-040-DL-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.15 X 040 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 16.000" (406.40mm) 0.230" (5.84mm) Unplated - Adhesive
0C97055508
Laird Technologies EMI
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MOQ: 1  MPQ: 1
TWT COIL SNSAT PSA
Twist 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C97055517
Laird Technologies EMI
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MOQ: 1  MPQ: 1
TWT COIL SNB PSA
Twist 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
97071502
Laird Technologies EMI
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MOQ: 1  MPQ: 1
PUP,ASSY,BF
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97072100
Laird Technologies EMI
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MOQ: 1  MPQ: 1
CP,BF
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4B59AEH1K01382
Laird Technologies EMI
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 BELL
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4B78HA51K01600
Laird Technologies EMI
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 PSH
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98050017
Laird Technologies EMI
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MOQ: 1  MPQ: 1
HDWE GROUNDING STRIP
- 121°C Fingerstock Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) Tin 299.21μin (7.60μm) Adhesive
0C98055508
Laird Technologies EMI
Consulta
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MOQ: 1  MPQ: 1
TWT COIL SNSAT USFT PSA
Twist 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C98055517
Laird Technologies EMI
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MOQ: 1  MPQ: 1
TWT COIL SNB USF PSA
Twist 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
11-32RH-SN-0.73
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.11 X 0.32 SN 0.73--11-32RH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 0.730" (18.54mm) 0.320" (8.13mm) Tin Flash Adhesive
4F75EB51Z00780
Laird Technologies EMI
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MOQ: 1  MPQ: 1
IO NICU PTAF PU V0 REC
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0C97055518
Laird Technologies EMI
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MOQ: 1  MPQ: 1
TWT COIL NIE PSA
Twist 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Nickel 299.21μin (7.60μm) Adhesive
786057200
Laird Technologies EMI
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MOQ: 1  MPQ: 1
S3,STR,NIB,PSA,CTL
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23-S-60FS-SN-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.23 X 0.60 SN 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) Tin Flash Adhesive
4G55AB51G00199
Laird Technologies EMI
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MOQ: 1  MPQ: 1
GK NICU NRSG PU V0 DSH
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4J52EA51N00629
Laird Technologies EMI
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MOQ: 1  MPQ: 1
IO NICU MESHG PU V0 REC
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