- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Length：
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- Plating - Thickness：
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- Attachment Method：
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- Condiciones seleccionadas:
Descubre los productos 20
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
97
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3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | - | - | Hardware，Rivet，Solder | ||
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|
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Unplated | - | Adhesive | ||
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|
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,SNB,USFT
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- | 121°C | Fingerstock | Beryllium Copper | 0.260" (6.60mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
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Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL NIB
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | Nickel | Flash | Adhesive | |||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
AP PCS SNSAT CTL
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- | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 NI 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 SN 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SU 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | - | Adhesive |
