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- Operating Temperature:
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- Height:
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- Plating:
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- Condiciones seleccionadas:
Descubre los productos 1,795
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | 0.190" (4.83mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,RCC,PSA
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNSAT,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SU
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | 0.179" (4.55mm) | 16.000" (406.40mm) | 0.511" (12.98mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NID,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | 0.104" (2.64mm) | 16.000" (406.40mm) | 0.357" (9.07mm) | Nickel | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB,USF
|
- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip |