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Descubre los productos 1,795
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Wurth Electronics Inc. |
98
|
3 dias |
-
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MOQ: 1 MPQ: 1
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CONDUCTIVE NI/CU GLASS SLEEVE 1M
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WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | 0.157" (4.00mm) | - | - | - | ||
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Laird Technologies EMI |
71
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7X406.6MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.04mm) | 16.000" (406.40mm) | 0.275" (6.99mm) | - | - | Clip | ||
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Wurth Electronics Inc. |
67
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | 0.236" (6.00mm) | - | - | - | ||
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Laird Technologies EMI |
43
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
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Laird Technologies EMI |
39
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X431.8MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.176" (4.47mm) | 17.056" (433.22mm) | 0.295" (7.49mm) | - | - | Clip | ||
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Laird Technologies EMI |
56
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.20X381MM
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- | - | - | - | - | 15.000" (381.00mm) | 0.480" (12.20mm) | - | - | - | ||
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Laird Technologies EMI |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.4X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | - | - | Clip | ||
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Laird Technologies EMI |
33
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
35
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 13X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | ||
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Wurth Electronics Inc. |
69
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | 0.315" (8.00mm) | - | - | - | ||
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Laird Technologies EMI |
74
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Rivet | ||
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|
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Laird Technologies EMI |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | - | - | - | - | 15.000" (381.00mm) | 0.623" (15.82mm) | - | - | - | ||
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Laird Technologies EMI |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
71
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
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ITT Cannon，LLC |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
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ITT Cannon，LLC |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
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|
ITT Cannon，LLC |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
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Harwin Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Flash | Solder |
