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- Operating Temperature:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- RAM Size:
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- Program Memory Size:
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Descubre los productos 265
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
2,483
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
1,272
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | 128KB (128K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
963
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,280
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
534
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,698
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,098
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | 96KB (96K x 8) | - | A/D 8x10b | Internal | EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
1,234
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
555
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | HCS12 | 60 | 25MHz | 4K x 8 | 128KB (128K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
591
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | 128KB (128K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
1,200
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 91 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
1,260
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 24x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
557
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | HCS12 | 60 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
1,010
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
679
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
661
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 52LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR,PWM,WDT | HCS12 | 35 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,950
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
840
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 91 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD,POR,PWM,WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit |