- Packaging：
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- Series：
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- Operating Temperature：
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- Core Processor：
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- Speed：
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- RAM Size：
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- Program Memory Size：
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- EEPROM Size：
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- Data Converters：
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- Oscillator Type：
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- Condiciones seleccionadas:
Descubre los productos 98
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
555
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 128KB (128K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
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NXP USA Inc. |
1,260
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
557
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1,010
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
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NXP USA Inc. |
679
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 12K x 8 | 128KB (128K x 8) | 2K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
2,950
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
413
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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|
|
NXP USA Inc. |
480
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | POR，PWM，WDT | HCS12 | 60 | 16MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
479
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
284
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
405
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 14K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
103
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 105°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 32K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
519
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 20K x 8 | 512KB (512K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
220
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 128KB (128K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
1
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 4K x 8 | 64KB (64K x 8) | - | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
4
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | LVD，POR，PWM，WDT | HCS12X | 59 | 80MHz | 16K x 8 | 256KB (256K x 8) | 4K x 8 | A/D 8x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | ||
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NXP USA Inc. |
Consulta
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MCU 16BIT 16KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 1K x 8 | 16KB (16K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | POR，PWM，WDT | HCS12 | 60 | 25MHz | 2K x 8 | 32KB (32K x 8) | - | A/D 8x10b | Internal | EBI/EMI，SCI，SPI |
