- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
5,947
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3 dias |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK 1.95" TO220
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1.950" (49.53mm) | 1.900" (48.26mm) | 0.950" (24.13mm) | 3.0W @ 20°C | 2.50°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PIN BLACK
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1.500" (38.10mm) | 1.650" (41.91mm) | 1.000" (25.40mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.950" (49.53mm) | 1.900" (48.26mm) | 0.950" (24.13mm) | 5.0W @ 30°C | 2.50°C/W @ 400 LFM |
