- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
4,063
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.500" (63.50mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
2.500" (63.50mm) | Bolt On and PC Pin | TO-220 | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.000" (50.80mm) | Clip and PC Pin | TO-220 (Dual) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM |
