- Material：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 7
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
4,831
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLK ANODIZED
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- | Aluminum | 0.890" (22.61mm) | Press Fit, Slide On | 14-DIP and 16-DIP | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
10,857
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK SLIDE-ON 8-DIP
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- | Aluminum | 0.562" (14.27mm) | Press Fit, Slide On | 8-DIP | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Black Anodized | ||
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Wakefield-Vette |
927
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DPAK SMT TIN PLATED
|
217 | Copper | 0.740" (18.80mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINKS
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217 | Copper | 0.740" (18.80mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Aluminum | 0.890" (22.61mm) | Press Fit, Slide On | 14-DIP and 16-DIP | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | ||
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|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Aluminum | 0.562" (14.27mm) | Press Fit, Slide On | 8-DIP | 0.450" (11.43mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Aluminum | 0.890" (22.61mm) | Press Fit and PC Pin | 14-DIP and 16-DIP | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized |
