- Shape：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
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t-Global Technology |
5,198
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Square | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | ||
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t-Global Technology |
4,024
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3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Square | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | ||
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t-Global Technology |
1,483
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM W/TAPE
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | ||
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|
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t-Global Technology |
813
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM
|
- | Square, Fins | - | - | 0.236" (6.00mm) | ||
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t-Global Technology |
391
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
|
XL-25 | Square | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) |
